- 硬板制程能力
- 软板和软硬结合板制程能力
- 金属基板制程能力
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序号No 项目Item 工艺能力Technical Data 1 层数
Layer Count
1-40 Layers
1-40 层2 最大加工尺寸
Max. Board Size单双面板（Single/Double side PCB）: 600 * 1100mm
多层板（Multiplayer PCB）: 550 * 650mm3 板厚
Board Thickness
0.2-6.0mm 4 最小线宽线距
Min Line Width/Space
2mil/2mil(0.05/0.05mm)
5 最小阻焊桥
Min. Solder Mask Bridge
0.1mm(4mil)
6 完成孔径
Finish Drill Hole (Mechanical)
0.15mm--6.50m
7 孔壁铜厚
Hole Wall Cu
>0.020mm(0.8mil)
8 镀通孔径公差
Hole Dia. Tolerance (PTH)
±0.075mm(3mil)
9 非镀通孔径公差
Hole Dia. Tolerance (NPTH)
±0.05mm (2mil)
10 孔位公差
Hole Position Deviation
±0.05mm (2mil)
11 外型尺寸公差
Outline Tolerance
±0.10mm (4mil)
12 扭曲和弯曲
Twist &Bow
≤0.7%
13 绝缘电阻
Insulation Resistance
>1012Ω Norma
14 孔电阻
Through hole resistance
<300Ω Normal
15 抗电强度
Electric strength
>1.3 kv/mm
16 耐电流
Current breakdown
10A
17 抗剥离强度
Peel strength
1.4N/mm
18 阻焊剂硬度
S/M abrasion
>6H
19 热冲击
Thermal stres
288℃ 20 Sec
20 通断测试电压
Test Voltage
50-300V
21 最小盲埋孔
Min. blind/buried via
0.2mm/0.2mm(机械钻孔)
0.1mm(镭射钻孔)
22 基材
Available Laminates Materia
CEM1, CEM3, FR-4, 高Tg FR4, 铝基板Alu Base, 罗杰斯Rogers，泰康利Taconic, 雅龙Arlon，铁氟龙Teflon等
23 成品板厚公差
Finished board thickness tolerance
T>=0.8mm,Tolerance:+/-8%,T<0.8mm :+/-10%
24 外层铜厚
Out Layer Copper Thicknes
1oz--6oz
25 内层铜厚
Inner Layer Copper Thicknes
1/2oz--4oz
26 纵横比
Aspect Rati
15:1
27 最小阻焊桥
Min. Solder Mask Bridg
0.08mm
28 最小阻焊开窗
Mini. Solder Mask Clearanc
0.05mm
29 阻焊塞孔孔径
Plug Hole Diamete
0.2mm--0.50mm
30 阻抗控制公差
Impedance Control Toleranc
+/-5% & +/-10%
31 表面处理
Surface Treatment
有铅喷锡HASL，无铅喷锡HASL Lead-free，沉金、锡、银Immersion Gold/Tin/Silver，镀金Gold Plating，抗氧化OSP，金手指Gold Finger，蓝胶Peelable Mask
32 绝缘层厚度
Insulation Layer Thickness
0.075mm--5.00mm 33 特殊工艺
Special Technolog
电镀厚金Thick Hard Gold Plating, 盘中孔Via in Pad， 扩孔、沉头孔Counterbore & Countersunk etc.
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序号No 项目Item 工艺能力Technical Data 1 层数
Layer Count
软板：1-6层
Flex Board: 1-6 Layer
软硬结合板：2-8层
Rigid-flex Board: 2-8 Layer
2 基材
Laminate Materials
PI, PET, PEN, FR-4 3 最大尺寸
Max. Board Size
250mm*1200mm 4 外型公差
Board Outline Tolerance
±0.1mm 5 板厚
Board Thickness
0.10mm--0.4mm 6 板厚公差( t≥0.8mm)
Board Thickness Tolerance
±10% 7 最小线宽
Minimum Line
0.05mm(2mil) 8 最小线距
Minimum Space
0.05mm(2mil) 9 外层完成铜厚
Out Layer Copper Thickness
12um--70um 10 内层完成铜厚
Inner Layer Copper Thicknes
12um--35um 11 最小钻孔孔径
Min. Drilling Hole (Mechanical)
0.15mm 12 最大钻孔孔径
Diameter Tolerance (Mechanical)
0.075mm 13 对位
Registration (Mechanical)
0.075mm 14 阻焊层
Solder Mask Type
覆盖膜Coverlay 15 表面处理
Surface Finish
沉金ENIG，镀金Gold Plating，抗氧化OSP，沉锡Immersion Tin，沉银Immersion Silver 16 镀金
Gold Plating
鎳Nickel: 100u" - 200u"
金Gold: 1u"-4u"
17 沉鎳金
Immersion Nickel / Gold
鎳Nickel: 100u" - 200u"
金Gold: 1u"-5u"
18 沉银
Immersion Silver
银Silver: 6u" - 12u" 19 抗氧化
OSP
抗氧化膜的厚度Film: 8u" - 20u" 20 通断测试电压
Test Voltage
夹具测试Testing Fixture: 50-300V
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序号No 项目Item 工艺能力Technical Data 1 层数
Layer Count1-2 层Layer 2 板材
Laminate铝基板、铜基板
Alu Base, Copper Base3 完成板厚
Finish Board Thickness:0.5-3.0mm
4 最大尺寸
Max. Board Size1200mm x 600mm
5 绝缘层厚度
Insulating Layer Thickness50, 75, 100, 125, 150micron
6 最小线宽线距
Min trace Width/Spacing6mil/6mil(0.15/0.15mm)
7 铜厚
Copper Thickness0.5oz-3oz
8 最小孔径
Min hole size0.6mm
9 导热系数
Thermal Conductivity1.0-4.0W/m.K
10 铝基板材
Aluminum Type3003, 5052, 6061 etc.
11 击穿电压
Breakdown voltage2-8KV
12 最小阻焊桥
Min Solder Dam4mil
13 最小孔环
Min Hole Ring4mil
14 扭曲和弯曲
Twist& Bow≤0.7%
15 通断测试电压
Test Voltage50-300V
16 阻焊层颜色
Solder Mask Color白，黑，红，绿，蓝，黄
White, Black, Red, Green, Blue, Yellow17 丝印字符颜色
Silkscreen color白，黑
White, Black
18 外形公差
Tolerance of Profile+/-5mil
19 抗剥离强度
Peel Strength≥1.8N/MM 20 表面电阻
Surface Resistance≥ 1*105 M
21 介电常数
Dielectric Constant≤ 4.4
≤ 0.03
22 表面处理
Surface Treatment
无铅喷锡HASL Lead-free，沉金、锡Immersion Gold/Tin，抗氧化OSP，镀金Gold Plating
